DEEWONG2000: 4 source electron beam evaporator
This is a high vacuum system. In this system, up to five various materials can be evaporated in a single process. Four of them – by an electon beam and the fifth one – by thermal evaporation. A film thickness is controlled during evaporation with a thickness monitor.
DEEDIRECTORS2015: 8 source load-lock electron beam evaporator
This is a high vacuum system expected to come online sometime in 2014. In this system, up to six various materials can be evaporated in a single process. A load-lock will allows samples to be loaded without exposing the main chamber to air thus greatly reducing pumpdown time. The film thickness is controlled during evaporation with a thickness monitor.
TRION: PECVD/RIE system
This system uses di-ethyl silane (DES), NH3, N2, N2O for the PECVD deposition of Si3N4 and SiO2. It is also used as an RIE etcher for these materials with CF4/O2 chemistry as well as for O2 ashing/descum.