Thin Film Deposition

Evaporator_e-beamDEEWONG2000: 4 source electron beam evaporator

This is a high vacuum system.  In this system, up to five various materials can be evaporated in a single process.  Four of them – by an electon beam and the fifth one – by thermal evaporation.  A film thickness is controlled during evaporation with a thickness monitor.

 

 

HPIM1360DEEDIRECTORS2015: 8 source load-lock electron beam evaporator

This is a high vacuum system expected to come online sometime in 2014. In this system, up to six various materials can be evaporated in a single process.  A load-lock will allows samples to be loaded without exposing the main chamber to air thus greatly reducing pumpdown time.  The film thickness is controlled during evaporation with a thickness monitor.

 

TrionTRION: PECVD/RIE system

This system uses di-ethyl silane (DES), NH3, N2, N2O for the PECVD deposition of Si3N4 and SiO2.  It is also used as an RIE etcher for these materials with CF4/O2 chemistry as well as for O2 ashing/descum.