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AMPEL Advanced Nanofabrication Facility (ANF)
Home
Facility: Access and Info
Becoming a member
Fee structure
ANF Store
Webcams
Equipment
Equipment Reservation
Wetbench SOP
Analysis
FILMETRIX F20: Thin film thickness measurement system
ZEISS: Microscope with CCD camera
DEKTAK XT: Profilometer with 3D capability and imaging
ALPHA STEP 200: Profilometer
Etching
PLASMAQUEST: ECR plasma etcher
Plasma Etch PE-50 Plasma etcher/cleaner
XACTIX: XeF2 etcher
Thin Film Deposition
TRION: PECVD & RIE
DEEWONG-2000: 4 sources electron beam evaporator
DEEDIRECTORS-2015: 8 source load-lock electron beam evaporator
AIRCO TEMESCAL: Dual 3in source RF magnetron sputter system
BIG SPUTTER: Single 6in target RF magnetron sputter system
Lithography
CANON PLA-501F: Double Side Mask Aligner
Neutronix-Quintel NxQ4006: 100mm mask aligner
HEADWAY PMW32: Photoresist spinner
LAURELL WS-400-6NPP-LITE: Photoresist spinner
Furnaces
KSL-1100X: Box furnace
LINDBERG: Tube furnace
MINIBRUTE: Tube furnace
HEATPULSE 210: Rapid thermal anneal (RTA) system
Other
Processes
Lithography
AZ P4110 Process
AZ 4620 process
Silicone Rubber Micromolds (PDMS)
Thin film deposition
PECVD of SiNx and SiO2
Cleaning and wet etching
Si wafer cleaning
RCA-1 Si wafer cleaning
RCA-2 Si wafer cleaning
Piranha etch
BOE (Buffered Oxide Etch) and HF dip
Si anisotropic etch (KOH, TMAH)
Si Isotropic etch (HNA)
Glass substrate cleaning
Glass wet etching
Gold Etch Using Potassium Iodide Solution
Plasma processes
Processing links and resources
Education
SAFETY
People
Lukas Chrostowski
Josh Folk
Mario Beaudoin
Alina Kulpa
Jim Mackenzie
ANF Users
AMPEL
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