SBQMI nanofab is equipped for both contact (physical glass-mask) and maskless (software mask) photolithography. The former is supported by a Neutronix-Quintel model NXQ4006 mask-aligner with a 350W high-pressure mercury lamp, housed in the Class ISO-6 yellow room within the recently renovated cleanroom space, and the latter is supported by the industry-standard Heidelberg model MLA150 maskless tool with laser UV source, housed in the Class ISO-5 yellow room. An extracted wet bench, hot-plates and spinners, situated within the Class ISO-6 yellow cleanroom are also dedicated to photolithography. A wide range of positive and negative resists are supported, including SU-8. The facility has been also recently equipped with two Nikon optical microscopes with camera and metrology capability used for inspection that can be found in the cleanroom.
JBX-8100FS 100kV EBL tool capable of writing features as small as 5nm on wafers up to 200mm.
Location: Brim65 (basement of new wing)
Location: ISO-5 yellow room
The Heidelberg MLA150 maskless lithography system allows fast direct writing of patterns as precise as 1 micron. It can write on samples as small as 1×1 cm and up to 200 mm wafers.
Location: ISO-6 yellow room
This mask aligner is a mostly manual system that accepts pieces as small as 7x7mm and wafers up to 100mm diameter. It accepts mask plates 5″x5″ (125x125mm) with the main mask holder but has a holder that can accept mask plates as small as 3″x3″ (75x75mm). It’s optics delivers both 365nm and 405nm light. It is very easy to use for alignment. Although expandable to allow double-side alignment, it does not currently have the adapter to allow it.
Location: ISO 6 Yellow room
This tool allows 3D, 2 photon lithography. It’s main purpose is to create waveguides to mate different photonic circuits together.
In storage during cleanroom renos
This mask aligner is a semiautomatic system that works best with 4″ wafers. A mask plate has to be 5″ by 5″. The UV optics is 405 nm.
Location: ISO-5 yellow room wetbench
Currently reserved for spinning of Electron Beam Resists only. The spinner can accommodate wafers up to 200mm diameter.
Location: ISO-6 yellow room
Currently reserved for spinning of traditional photoresists such as AZ5214, S1813, etc. No EBL resists and no SU-8 allowed in spinner.
This programmable spinner allows spinning various photoresists on wafers of various sizes. The maximum size wafer that can be accommodated by this spinner is a 6″ wafer.
Location: currently offline
Currently reserved for spinning SU-8 photoresists. It is the only spinner where SU-8 is allowed.
This programmable spinner allows spinning of various photoresists on wafers of various sizes. The maximum size wafer that can be accommodated by this spinner is a 6″ wafer.
New home: Brim442
This equipment allows direct projection of a mask pattern onto a wafer without need of a physical mask. It is part of the AdaMIST laboratory managed by Prof. Edmond Cretu.