Thin film deposition

PECVD of SiNxand SiO2

This procedure explains, with some detail, how to obtain high quality silicon nitride and silicon dioxide films using the ANF PECVD tool.  This process involves physical and plasma cleaning and a passivation/calibration deposition prior to deposition on the desired sample.

 

 

Evaporator_e-beamDEEWONG2000: 4 source electron beam evaporator

This is a high vacuum system. In this system, up to five various materials can be evaporated in a single process. Four of them – by an electon beam and the fifth one – by thermal evaporation. A film thickness is controlled during evaporation with a thickness monitor.

 

 

HPIM1360DEEDIRECTORS2015: 8 source load-lock electron beam evaporator

This is a high vacuum system expected to come online sometime in 2014. In this system, up to six various materials can be evaporated in a single process. A load-lock will allows samples to be loaded without exposing the main chamber to air thus greatly reducing pumpdown time. The film thickness is controlled during evaporation with a thickness monitor.