XACTIX: XeF2 etcher

Contents: Xactix

This is a dry etching system.  It uses Xenon Difluoride for isotropic Silicon etch.

Important: Wafer surfaces need to be dehydrated immediately prior to etching for about 5 minutes.  Otherwise a thin silicon fluoride polymer layer forms due to a reaction with the water on the silicon. This can dramatically reduce the etch rate, or even stop it completely.
Process information can be found on manufacturer website
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