Oxford COBRA: ICP plasma etcher
Location: ISO-6 white room
This system uses C4F8, O2, SF6 and Ar chemistries. It is dedicated to shallow silicon etching.
Samco RIE 10-NR
Location: ISO-6 white room
This system uses CF4, CHF3, O2, SF6 and Ar chemistries. It is dedicated to etching of superconducting metals. Other materials may be allowed in the system upon discussion with ANF staff.
PLASMAQUEST: ECR plasma etcher
Location: Brim449
This system uses CF4, CHF3, O2 and Ar chemistries. It is used extensively to etch SOI and GaAs based photonic nanocrystals, GaAs based VCSELs as well as various other materials.
Plasma-Etch PE-50: Plasma etcher
Location: ISO-6 white room
The system uses Ar and O2 gases. It can be used for descum, or total removal of photoresist.
XACTIX: XeF2 etcher
Location: ISO-6 white room
This is a dry etching system. It uses Xenon Difluoride for isotropic Silicon etch.
TRION: RIE/PECVD system
Location: ISO-6 white room
This system uses di-ethyl silane (DES), NH3, N2, N2O and has been optimized for the PECVD deposition of Si3N4 and SiO2. However, it can also be used as an RIE etcher for these materials with CF4/O2 chemistry as well as for O2 ashing/descum.