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SBQMI Advanced Nanofabrication Facility (ANF)
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    • Becoming a member
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    • Wetbench SOP
    • Analysis
      • FILMETRIX F20: Thin film thickness measurement system
      • ZEISS: Microscope with CCD camera
      • DEKTAK XT: Profilometer with 3D capability and imaging
      • ALPHA STEP 200: Profilometer
    • Etching
      • PLASMAQUEST: ECR plasma etcher
      • Plasma Etch PE-50 Plasma etcher/cleaner
      • XACTIX: XeF2 etcher
    • Thin Film Deposition
      • TRION: PECVD & RIE
      • DEEWONG-2000: 4 sources electron beam evaporator
      • DEEDIRECTORS-2015: 8 source load-lock electron beam evaporator
      • AIRCO TEMESCAL: Dual 3in source RF magnetron sputter system
      • AJA Hybrid Evaporator System
    • Lithography
      • JEOL JBX-8100FS ELECTRON-BEAM LITHOGRAPHY SYSTEM
      • Heidelberg MLA-150 Maskless Lithography System
      • Neutronix-Quintel NxQ4006: 100mm mask aligner
      • Photonic Wire Bonder – Vanguard Photonics
      • HEADWAY PWM32 and PWM50: Photoresist spinners
      • LAURELL WS-400-6NPP-LITE: Photoresist spinner
      • CANON PLA-501F: Double Side Mask Aligner
    • Furnaces
      • KSL-1100X: Box furnace
      • LINDBERG: Tube furnace
      • MINIBRUTE: Tube furnace
      • HEATPULSE 210: Rapid thermal anneal (RTA) system
    • Other
  • Processes
    • Lithography
      • AZ P4110 Process
      • AZ 4620 process
      • Silicone Rubber Micromolds (PDMS)
    • Thin film deposition
      • PECVD of SiNx and SiO2
    • Cleaning and wet etching
      • Si wafer cleaning
      • RCA-1 Si wafer cleaning
      • RCA-2 Si wafer cleaning
      • Piranha etch
      • BOE (Buffered Oxide Etch) and HF dip
      • Si anisotropic etch (KOH, TMAH)
      • Si Isotropic etch (HNA)
      • Glass substrate cleaning
      • Glass wet etching
      • Gold Etch Using Potassium Iodide Solution
    • Plasma processes
    • Processing links and resources
  • Education
  • SAFETY
  • People
    • Kostis Michelakis
    • Mario Beaudoin
    • Andrey Blednov
    • Khush Hydri
    • Matthias Kroug
    • Lukas Chrostowski
    • Josh Folk
    • Alina Kulpa
    • Jim Mackenzie
    • ANF Users
  • SBQMI
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» Home » Processes » Plasma processes

Nanofab status

Home
Facility: Access and Info
Becoming a member
Fee structure
ANF Store
Webcams
Equipment
Equipment Status
Equipment Reservation
Wetbench SOP
Analysis
FILMETRIX F20: Thin film thickness measurement system
ZEISS: Microscope with CCD camera
DEKTAK XT: Profilometer with 3D capability and imaging
ALPHA STEP 200: Profilometer
Etching
PLASMAQUEST: ECR plasma etcher
Plasma Etch PE-50 Plasma etcher/cleaner
XACTIX: XeF2 etcher
Thin Film Deposition
TRION: PECVD & RIE
DEEWONG-2000: 4 sources electron beam evaporator
DEEDIRECTORS-2015: 8 source load-lock electron beam evaporator
AIRCO TEMESCAL: Dual 3in source RF magnetron sputter system
AJA Hybrid Evaporator System
Lithography
JEOL JBX-8100FS ELECTRON-BEAM LITHOGRAPHY SYSTEM
Heidelberg MLA-150 Maskless Lithography System
Neutronix-Quintel NxQ4006: 100mm mask aligner
Photonic Wire Bonder – Vanguard Photonics
HEADWAY PWM32 and PWM50: Photoresist spinners
LAURELL WS-400-6NPP-LITE: Photoresist spinner
CANON PLA-501F: Double Side Mask Aligner
Furnaces
KSL-1100X: Box furnace
LINDBERG: Tube furnace
MINIBRUTE: Tube furnace
HEATPULSE 210: Rapid thermal anneal (RTA) system
Other
Processes
Lithography
AZ P4110 Process
AZ 4620 process
Silicone Rubber Micromolds (PDMS)
Thin film deposition
PECVD of SiNx and SiO2
Cleaning and wet etching
Si wafer cleaning
RCA-1 Si wafer cleaning
RCA-2 Si wafer cleaning
Piranha etch
BOE (Buffered Oxide Etch) and HF dip
Si anisotropic etch (KOH, TMAH)
Si Isotropic etch (HNA)
Glass substrate cleaning
Glass wet etching
Gold Etch Using Potassium Iodide Solution
Plasma processes
Processing links and resources
Education
SAFETY
People
Kostis Michelakis
Mario Beaudoin
Andrey Blednov
Khush Hydri
Matthias Kroug
Lukas Chrostowski
Josh Folk
Alina Kulpa
Jim Mackenzie
ANF Users
SBQMI
AMPEL
Contact us

Archives

  • November 2019
  • February 2019
  • May 2018
  • April 2014
  • March 2013

Plasma processes

image: Oxford COBRA ICP etcherhttp://www.nanofab.ubc.ca/equipment/etching-4/oxford-cobra-icp-etcher/

 

 

 

 

 

plasmaquest

http://www.nanofab.ubc.ca/equipment/etching-4/ecr-etcher/

 

 

 

 

 

 

http://www.nanofab.ubc.ca/equipment/etching-4/pe-50-planar-etcher/

 

 

 

  Handbook of Plasma Processing Technology – Fundamentals, Etching, Deposition, and Surface Interactions

SBQMI Advanced Nanofabrication Facility
Vancouver Campus
2355 East Mall
Vancouver, BC Canada V6T 1Z4
Tel 604 827 3228
Website www.nanofab.ubc.ca
Email anf@ampel.ubc.ca
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