Box (muffle) furnace used for bonding or other thermal treatments.
In this system wafers can be very fast annealed up to 600 C. This RTA has been recently upgraded and a new SOP for it will be provided in the near future. (System currently offline)
This tube furnace can accept wafers up to 2″ (50 mm) in diameter. The controller manages temperature from 200 C up to 1100 C. Each material processed in this furnace requires its own quartzware to prevent cross contamination. This furnace is mostly used for wet and dry oxidation.
This furnace is a computer controlled tube (5″ diam.) furnace. The maximum processing temperature is 1100 C. Each material processed in this furnace requires its own quartzware to prevent cross contamination. The maximum wafer size accepted is 4 ” (100 mm).