FILMETRIX F20: Thin film thickness measurement system

ZEISS: Microscope with CCD camera

DEKTAK XT: Profilometer with 3D capability and imaging

ALPHA STEP 200: Profilometer

PLASMAQUEST: ECR plasma etcher

Plasma Etch PE-50 Plasma etcher/cleaner

XACTIX: XeF2 etcher

TRION: PECVD & RIE

DEEWONG-2000: 4 sources electron beam evaporator

DEEDIRECTORS-2015: 8 source load-lock electron beam evaporator

AIRCO TEMESCAL: Dual 3in source RF magnetron sputter system

AJA Hybrid Evaporator System

JEOL JBX-8100FS ELECTRON-BEAM LITHOGRAPHY SYSTEM

Heidelberg MLA-150 Maskless Lithography System

Neutronix-Quintel NxQ4006: 100mm mask aligner

Photonic Wire Bonder – Vanguard Photonics

HEADWAY PWM32 and PWM50: Photoresist spinners

LAURELL WS-400-6NPP-LITE: Photoresist spinner

CANON PLA-501F: Double Side Mask Aligner

KSL-1100X: Box furnace

LINDBERG: Tube furnace

MINIBRUTE: Tube furnace

HEATPULSE 210: Rapid thermal anneal (RTA) system

AZ P4110 Process

AZ 4620 process

Silicone Rubber Micromolds (PDMS)

PECVD of SiNx and SiO2

Si wafer cleaning

RCA-1 Si wafer cleaning

RCA-2 Si wafer cleaning

Piranha etch

BOE (Buffered Oxide Etch) and HF dip

Si anisotropic etch (KOH, TMAH)

Si Isotropic etch (HNA)

Glass substrate cleaning

Glass wet etching

Gold Etch Using Potassium Iodide Solution