(Given to CHBL) Philips X’Pert Pro MRD X-ray Diffraction System
This dicing saw is able to dice wafers up to 200 mm diameter. It can dice several materials ranging from semiconductor wafers to ceramics and other substrates. Discuss with ANF staff to determine if it can server your needs.
Work is performed by ANF operators with exceptions allowable for heavy users.
Currently offline but located in SBQMI machine shop
No SOPs yet as this work is usually performed by ANF staff only. Please contact the ANF staff if you need such services.